Via Launches Via QSM-8Q60 Qseven Module

Sept. 23, 2015

Via Technologies Inc. on Sept. 22, announced the launch of the Via QSM-8Q60 Qseven form factor module powered by a 1.0GHz Freescale i.MX 6DualLite Cortex-A9 SoC. 

The Via QSM-8Q90 module measures 70mm x 70mm and is compliant with the Qseven Rev. 2.0 embedded form factor standard adopted by the Standardization Group for Embedded Technologies e.V. (SGeT). 

“The explosive growth of the Internet of Things is leading to growing demand for highly-customized systems targeted at a plethora of commercial IoT applications,” said Richard Brown, vice president of international marketing, Via Technologies Inc. “With its modular low power design and comprehensive BSP and software support services, the Via QSM-8Q90 addresses this need by minimizing development costs and accelerating the time-to-market.”

In addition to its 1.0GHz Freescale i.MX 6DualLite Cortex-A9 SoC, the Via QSM-8Q90 features an on-board Micro SD card slot, 4GB eMMC Flash memory and 2GB DDR3-10666 SDRAM. The module also offers I/O and display expansion options, including four USB 2.0 ports, one HDMI port, one dual-channel 18/24-bit LVDS panel, two COM ports, Gigabit Ethernet, CAN bus and PCIe x1. 

The Via QSM-8Q60 features a Linux BSP which includes the kernel (3.0.35) and bootloader source codes. Other features include a Tool Chain to help make adjustments to the kernel and to support the Via QSMBD2 carrier board I/O and other hardware features. A full set of software customization services that speed up time to market and minimize development costs is also available.